EO/IR AI tracking

NEXUS-640-1080 — Single-Board EO/IR AI Tracking Module

Visible 0.4–0.7 μm + LWIR 8–14 μm

A single-board dual-channel EO/IR module combining 640×512 LWIR, 1920×1080 visible imaging, H.265 Ethernet streaming, and AI tracking above 50 Hz.

NEXUS-640-1080
640×512
Thermal
1920×1080
Visible
>50 Hz
Tracking
100M Ethernet
Network

Overview

A single-board dual-channel EO/IR module integrating a 640×512, 12 μm uncooled LWIR channel, a 1920×1080 visible channel, and an embedded AI processing platform — deep-learning tracking above 50 Hz with H.265 video over 100 Mbps Ethernet.

Integration at a Glance

Footprint 70×60 mm board
Weight ≤140 g
Power ≤10 W
Supply DC 5.5 V

Key Features

Engineering profile

  • Thermal imaging, visible-light imaging, processing, and interface boards are integrated on a single compact platform; the standard configuration pairs a 25 mm athermalized thermal lens with a 10.44 mm visible lens, with lens options per project.

Key capabilities

  • Thermal channel: 640×512, 12 μm, VOx LWIR, NETD ≤40 mK
  • Visible channel: 1920×1080, 3.45 μm, RGB24; FOV 35.2°×20.2°
  • AI tracking: deep-learning tracking >50 Hz, adaptive target boundary; recognition >15 fps for 4K×3K on one NPU
  • Network video: H.265 over 100 Mbps Ethernet (UDP/RTSP); 1080p or 960×540 center crop; JPEG capture

Image processing and control

  • Thermal NUC (automatic/manual/disabled), white-hot/black-hot polarity, brightness/contrast adjustment (0–255), DDE enhancement, image flip, visible dehazing and sharpening.
  • Real-time tracking with configurable recognition models, OSD overlay, JPEG snapshots, self-test and status reporting, and remote FPGA/RK3588/algorithm upgrade.

Design Differentiators

AI tracking engine

  • Deep-learning-based visual tracking running above 50 Hz on the embedded NPU, with adaptive target boundary estimation and automatic re-detection after brief occlusion.
  • Multi-class recognition pipeline at >15 fps (4K×3K input, single NPU); model set configurable per deployment.
  • On-screen display with target bounding box, tracking status, and metadata overlay; H.265-encoded streaming with OSD burned in.

Thermal Channel

Detector & Performance

Array format640×512
Detector typeVOx uncooled LWIR
Pixel pitch12 μm
Spectral bandLWIR 8–14 μm
Thermal sensitivityNETD ≤40 mK; MRTD ≤0.5 K
Frame rate50 Hz

Lens & FOV

Lens option25 mm athermalized (optional)
Field of view17.4° × 14°

Visible Channel

Sensor & Performance

Array format1920×1080
Pixel pitch3.45 μm
Spectral bandVisible 0.4–0.7 μm, RGB24
Frame rate50 Hz

Lens & FOV

Lens option10.44 mm
Field of view35.2° × 20.2°

Technical Specifications

Thermal & Visible Channels

Thermal channel 640×512, 12 μm, VOx LWIR
Thermal sensitivity NETD ≤40 mK; MRTD ≤0.5 K
Visible channel 1920×1080, 3.45 μm, RGB24
Lens configuration LWIR 25 mm optional; visible 10.44 mm
Field of view LWIR 17.4°×14°; visible 35.2°×20.2°

AI Tracking & Video

Tracking performance >50 Hz
Recognition performance >15 fps for 4K×3K on one NPU; model-dependent
Encoding / network H.265, 100 Mbps Ethernet, UDP/RTSP
Output format 1080p or 960×540 center crop; JPEG capture
Frame rate 50 Hz output

Interfaces & Power

Control interface Ethernet / RS422 / SPI
Start-up / readiness ≤15 s
Power supply DC 5.5 V
Power consumption ≤10 W @ 25 °C, tracking excluded
Dimensions AI board 70×60×16.6 mm
Weight ≤140 g excluding lenses
Operating temperature −40 to +70 °C
Storage temperature −45 to +80 °C

Network, Storage & Environment

Default network IP 192.168.1.79; gateway 192.168.1.1
Video storage MKV/MP4, time-named files, 4 h loop recording
Program upgrade FPGA via J3 serial; RK3588 & AI model via J2 Ethernet
Connectors J2 Ethernet (HC-1D0-4PLT); J4 SPI+RS422 (HC-1.0-8PLT); J5 power (HX20007-4A)
Altitude 20,000 m
Overload resistance Axial ≥80 g (300 ms half-sine); radial ≥10 g
EMC CE102, CS101, CS112, CS114, CS115, CS116, RE102, RS103 (system-level)

Mechanical Dimensions

LWIR module — mechanical views (mm) — NEXUS-640-1080
LWIR module — mechanical views (mm)
Visible module — mechanical views (mm) — NEXUS-640-1080
Visible module — mechanical views (mm)
Processing and interface boards — mechanical views (mm) — NEXUS-640-1080
Processing and interface boards — mechanical views (mm)

Mechanical integration

  1. The LWIR drawing shows a 35 × 35 mm envelope, 31 ± 0.1 mm mounting-hole spacing, four M2 holes 4 mm deep and a 23 mm core depth.
  2. The visible-board drawing shows a 38 × 27 mm envelope, 27 ± 0.1 mm and 17 ± 0.1 mm mounting dimensions, four Ø1.8 mm holes and a 5.73 mm profile.
  3. The processing drawing shows a 70 × 60 mm board with 60 ± 0.1 mm and 50 ± 0.1 mm mounting-hole spacing and four Ø2.8 mm holes; the interface-board view carries the 75 mm profile and 2 × R75 callouts.
  4. Use the detailed drawings for mounting geometry and the specification table for the overall envelope. Confirm controlled drawings, tolerances, connector clearance and lens volumes before final mechanical design.

Specifications reflect the supplied technical document. Lens, connector, mechanical, and environmental options may be finalized for the target program.

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Thermal sensitivity
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Spectral band
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Dimensions
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Detector
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Resolution
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Pixel pitch
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Spectral band
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Interested in NEXUS-640-1080?

Contact our engineering team to discuss integration requirements, custom configurations, and volume pricing.