Single-Chip Dual-Band

FUSION-1280-2560 — High-Resolution Single-Chip Dual-Band Module

LWIR 8–14 μm + Visible 0.4–0.9 μm

High-resolution dual-band module. Up to 1280×1024 LWIR + 2560×1440 visible. CML or MIPI. 35×35mm, DC 5V. Two detector configuration options.

FUSION-1280-2560
1280×1024
Thermal
2560×1440
Visible
CML / MIPI
Interface
35×35 mm
Footprint

Overview

The highest-resolution single-chip dual-band module in the FUSION family, combining up to 1280×1024 LWIR with up to 2560×1440 visible imaging on a single 35×35 mm board. Two detector configurations let system designers prioritize either infrared or visible resolution, with CML or MIPI video interface selection for seamless integration into SoC and FPGA platforms.

Integration at a Glance

Footprint 35×35 mm
Power DC 5 V
Interface CML / MIPI
Lens types 4 options

Product Views

Design Differentiators

Single-chip integration

  • Both LWIR and visible detectors share a single 35×35 mm board stack, eliminating the mechanical alignment and synchronization challenges of discrete dual-sensor designs.
  • Factory-calibrated pixel-level registration between thermal and visible channels simplifies downstream fusion algorithms and reduces integration effort.

Dual-config architecture

  • Choose between two SKUs: Visible Priority (IR 1080×1024 + VIS 2560×1920) for high-detail daytime payloads, or IR Priority (IR 1280×1024 + VIS 2560×1440) for long-range thermal detection.
  • Both variants share the same mechanical footprint and pinout, allowing platform reuse across mission profiles.

Thermal Channel

Detector & Performance

Array formatUp to 1280×1024 (IR priority config)
Pixel pitch12 μm
Spectral bandLWIR 8–14 μm
Configuration option 1IR 1080×1024 + VIS 2560×1920 (visible priority)
Configuration option 2IR 1280×1024 + VIS 2560×1440 (IR priority)

Lens & Optics

Compatible lensesFixed-focus athermalized, continuous zoom, motorized focus, dual FOV

Visible Channel

Sensor & Performance

Array formatUp to 2560×1920 (visible priority config)
Pixel pitch2.5 μm
Spectral bandVisible 0.4–0.9 μm
Output interfaceCML or MIPI (selectable)

Video Interface

CML interfaceParallel video for FPGA / SoC integration
MIPI interfaceMIPI CSI-2 for application processor platforms

System & Integration

Electrical

Power supplyDC 5 V
CommunicationRS422 control interface
Video interfaceCML / MIPI (selectable per config)

Mechanical

Footprint35×35 mm
Lens optionsFixed athermalized / continuous zoom / motorized focus / dual FOV

Technical Specifications

Thermal & Visible Channels

IR resolution Up to 1280×1024
Visible resolution Up to 2560×1440
IR spectral band LWIR 8–14 μm
IR pixel pitch 12 μm
Visible pixel pitch 2.5 μm
Configuration option 1 IR 1080×1024 + VIS 2560×1920
Configuration option 2 IR 1280×1024 + VIS 2560×1440

Video & Interfaces

Video interface CML / MIPI
Communication RS422
CML output Parallel video for FPGA / SoC integration
MIPI output MIPI CSI-2 for application processor platforms

Power & Mechanical

Power supply DC 5 V
Footprint 35×35 mm
Compatible lenses Fixed-focus athermalized, continuous zoom, motorized focus, dual FOV

Mechanical Dimensions

Imaging core — mechanical views (mm) — FUSION-1280-2560
Imaging core — mechanical views (mm)

Mechanical integration

  1. The core drawing shows a 35 × 35 mm envelope, 31.5 ± 0.1 mm mounting-hole spacing, four M2 holes 4 mm deep and a bracketed 29.6 mm core depth.
  2. The source drawing includes the 8.8 ± 0.1 mm datum and FPA/optical-center markers; preserve these references when designing the lens and host bracket.
  3. The drawing covers the imaging core, not the selected lens or external cable clearance. Confirm the controlled 2D drawing, tolerances and configuration-specific stack-up before final mechanical design.

Specifications subject to change without notice. Lens options and performance metrics depend on the selected configuration and optics.

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Thermal channel
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Thermal sensitivity
NETD ≤60 mK; MRTD ≤0.45 K
Visible channel
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Spectral band
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Thermal channel
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Visible channel
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Lens configuration
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Resolution
1280×1024
NETD
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Interface
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Power
<4 W

Interested in FUSION-1280-2560?

Contact our engineering team to discuss integration requirements, custom configurations, and volume pricing.