Imaging Module Products
Professional infrared and electro-optical imaging modules for EO/IR system integrators. Cooled MWIR, uncooled LWIR, SWIR, visible light, and AI multi-band solutions.
IR Modules SPECTRA Series
Cooled Infrared Modules
1024 High-Temp Cooled Mid-wave Infrared Module
No overexposure in daylight, no grayish tone at night. Compatible with fixed, zoom, motorized, and dual FOV lenses.
1280 Cooled Mid-wave Infrared Imaging Module
Compact size, ultra-low power consumption. Optical Module / SDI / CameraLink interface options.
640 Cooled Mid-wave Infrared Imaging Module
AVT / SDI / CameraLink with RS422/CAN comms. Ideal for compact EO/IR payloads requiring high sensitivity.
Uncooled Infrared & Visible Modules
1280 Long-wave Infrared Imaging Module
Four interface variants: MIPI, CameraLink, BT1120, CML. Ultra-compact 35×35mm board-level module.
640 Long-wave Infrared Imaging Module
Five interface variants: MIPI, SDI, CameraLink, BT1120, AVT. From 26×26mm. DC 5V or 12V options.
640 Polarimetric Long-wave Infrared Module
Polarimetric LWIR for camouflage detection and material discrimination. 7μm pixel pitch.
Modular Visible Light Imaging Module
1920×1080 Full HD with POE interface. Hisilicon platform. Rolling shutter with RS232/RS422 comms.
Short-wave (TEC) Cooled Infrared Module
TEC cooled SWIR for night vision, laser spot detection, and through-glass imaging applications.
Split-type Visible Light Imaging Module
FPGA platform, global shutter. From 1080p to 4K (3840×2160). Multiple interface variants via MIPI/CML/SDI/CameraLink.
Dual-Band Modules FUSION Series
Single-chip dual-band fusion on a 35×35mm board. Simultaneous visible light + LWIR output with ultra-low latency and minimal power draw.
FUSION LV0625A Dual-Band Module
Ultra-low cost, ultra-low latency. Visible 2560×1440 + LWIR 640×512 in 35×35mm. MIPI interface.
FUSION LV1225A Dual-Band Module
Two resolution configurations. Up to 1280×1024 IR + 2560×1440 visible. CML or MIPI output.
AI Imaging Systems NEXUS Series
Single-board multi-band systems with freely configurable IR + visible bands and integrated AI processing. Deploy custom detection and tracking algorithms on-device.
NEXUS Series AI Multi-band Imaging System
Configurable IR band + visible combination with on-device AI processing. Supports custom algorithm deployment for intelligent detection and tracking.
Chip-Level Products
In Development
IRmodules is currently developing chip-level detector and readout IC products. Register your interest to receive updates when chip-level products become available.
Register InterestNeed a Custom Solution?
Our engineering team provides deep customization — interfaces, resolution, integration, and algorithm development tailored to your system.
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