The FUSION LV0625A achieves dual-band imaging — simultaneous LWIR thermal and high-resolution visible — from a single 35×35 mm chip module. The MIPI interface enables direct connection to application processors and SoCs, while DC 5V operation ensures compatibility with standard drone and embedded system power.

Ultra-Low Cost Dual-Band

The LV0625A’s single-chip architecture eliminates the alignment and integration complexity of separate IR + visible modules, dramatically reducing total payload cost and system development time. A single module provides the input for IR/visible fusion, day/night switching, or parallel stream processing.

Key Features

  • Single-chip 35×35 mm — smallest dual-band form factor in the product range
  • Simultaneous 640×512 IR + 2560×1440 visible via single MIPI output
  • Ultra-low latency — optimized pipeline for real-time fusion and tracking
  • Ultra-low power — DC 5V with minimal current draw
  • Ultra-low cost — single-chip integration eliminates optical alignment cost

Typical Applications

Mass-market UAV dual-band payloads, consumer/prosumer thermal-visible cameras, small gimbal systems, handheld dual-band devices, and cost-sensitive surveillance OEM products.