Multi-Spectral EO/IR Imaging Modules
From uncooled LWIR to cooled MWIR, single-band to AI-integrated dual-band — IRmodules supplies precision imaging cores to EO/IR system integrators worldwide, engineered and manufactured in Wuhan, China.
Three Imaging Module Families
SPECTRA single-band thermal, FUSION dual-band, and NEXUS AI-integrated systems — every EO/IR imaging need covered under one roof.
SPECTRA Series — Single-Band Thermal
From 26×26mm compact uncooled LWIR boards to 1280-resolution cooled MWIR cores. Five interface variants: MIPI, SDI, CameraLink, BT1120, AVT.
FUSION Series — Dual-Band
Industry's first single-chip LWIR + visible dual-band module. 35×35mm, DC 5V, pixel-aligned IR and visible output with ultra-low latency and on-module sync.
NEXUS Series — AI Imaging System
Single-board AI imaging system with integrated NPU. Freely configurable IR + visible band combination. Ethernet/SDI output, custom algorithm deployment supported.
Precision Imaging from Core to System
Upstream module supply and deep customization for EO/IR system integrators — engineered in Wuhan's national optoelectronics hub.
Full Spectral Coverage
Visible, low-light, SWIR (0.9–1.7μm), MWIR (3–5μm), and LWIR (8–14μm) — one supplier for every band in your EO/IR system.
SWaP-Optimized Design
From 26×26mm uncooled boards to 35×35mm dual-band modules at DC 5V — purpose-built for UAV, gimbal, and soldier-worn platforms.
Universal Interface Support
SDI, CameraLink, MIPI CSI-2, BT1120, CML LVDS, Ethernet, RS422, CAN — full compatibility with global system architectures.
OEM Deep Customization
Custom interface variants, lens mounts, connector placement, NUC timing, and algorithm model integration for production programs.
Where Our Modules Perform
From airborne fire control to UAV power inspection — IRmodules imaging cores are deployed across military, security, and industrial platforms worldwide.
News & Technical Articles
Product announcements, integration guides, and application insights from the IRmodules engineering team.
How to Choose 12μm vs 17μm Pixel Pitch?
How to choose 12μm vs 17μm pixel pitch in thermal imaging modules by comparing FOV, focal length, IFOV, range, optics size, NETD, and system cost tradeoffs.
Read More →
12μm vs 17μm Pixel Pitch in Thermal Imaging
Compare 12μm vs 17μm pixel pitch in thermal imaging, including IFOV, lens size, NETD, sensitivity, cost, and OEM module selection trade-offs for engineers.
Read More →
How Big Is the Difference Between a 640 Infrared Core and a 1280 Infrared Core?
640 infrared core vs 1280 infrared core: compare pixels, field detail, optics, bandwidth, AI detection, cost, and when each choice makes sense.
Read More →Ready to Build Your EO/IR System?
Discuss your requirements with our engineers. Custom modules, interface variants, and production-scale supply — all from Wuhan's Optics Valley.
Contact IRmodules